2026-07-28 |
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2026 Semiconductor Investment Guide

Semiconductor Industry: The Cornerstone of the AI Revolution and Investment Opportunities in 2026

Keywords: Semiconductor, Artificial Intelligence, Investment Strategies, Technology Trends, Global Supply Chain, Advanced Manufacturing

Introduction

Few industries serve as the bedrock of modern technological civilization like semiconductors. These tiny silicon chips—often no larger than a fingernail—power everything from smartphones and cars to medical devices and supercomputers. Yet by 2026, the semiconductor industry faces an unprecedented turning point in its history. The explosive growth of artificial intelligence, the relentless pursuit of smaller process nodes, and intensifying geopolitical competition converge to create a landscape of unparalleled opportunity and complexity. For investors, technologists, and policymakers, understanding the forces shaping the semiconductor industry is no longer optional—it is essential.

As we navigate this critical juncture, a major question emerges: How can capital be deployed wisely to capture the long-term value of this transformative technology? This article provides a comprehensive analysis of the semiconductor industry's current state, technology trajectory, geopolitical dynamics, and actionable investment strategies for 2026.

2026 AI Stock Investment Guide

Figure 1: The convergence of AI and semiconductors creates a new paradigm for growth investing. Source: Industry analysis.

Current Landscape of the Semiconductor Industry

Driven by demand from data centers, automotive, and consumer electronics, the global semiconductor market generated over $600 billion in annual revenue in 2025. According to the Semiconductor Industry Association (SIA), sales are projected to reach $700 billion by 2027, with AI-related chips accounting for more than 30% of growth. The industry is dominated by a few key players: TSMC controls over 60% of advanced logic manufacturing, Samsung Electronics leads in memory and foundry, and Intel undergoes a transformation amid challenges in its foundry ambitions. On the design side, NVIDIA, AMD, and Broadcom boast the highest profit margins riding the AI wave.

However, beneath these impressive numbers, critical structural shifts are occurring. The traditional Moore's Law—the observation that transistor density roughly doubles every two years—is slowing. While 3nm and 2nm nodes have entered mass production, the cost per transistor is no longer declining at historical rates. As physical limits approach, the industry has pivoted to architectural innovations such as chiplets, advanced packaging, and heterogeneous integration. These trends are reshaping the competitive landscape, creating winners and losers.

The Role of Capital Intensity

Semiconductor manufacturing has become one of the most capital-intensive industries on Earth. A state-of-the-art 2nm wafer fab now costs up to $20 billion to build, and R&D expenses for cutting-edge logic chips exceed 25% of revenue. This extreme cost structure creates high entry barriers and reinforces the power of incumbents. It also means investment decisions must account for multi-year lead times and significant execution risk. For stock investors, understanding each company's balance sheet strength and technology roadmap is crucial.

AI-Driven Demand Surge: The New Growth Engine

The most transformative force in the semiconductor industry today is artificial intelligence. Generative AI models, such as large language models (LLMs) and diffusion models, require immense computational resources for training and inference. Training a GPT-4-level model may require tens of thousands of graphics processing units (GPUs) running for months, consuming megawatts of power. This insatiable demand for computing has propelled NVIDIA's revenue to record levels, with its data center division generating over $50 billion in annual revenue by early 2026.

However, the AI chip market is evolving rapidly. While GPUs remain the dominant architecture for AI workloads, custom application-specific integrated circuits (ASICs)—such as Google's Tensor Processing Units (TPUs) and Amazon's Trainium—are gaining traction in hyperscale data centers. Meanwhile, the emergence of edge AI (where inference occurs on devices rather than in the cloud) is creating demand for energy-efficient neural processing units (NPUs) in smartphones, laptops, and IoT devices.

Memory and Interconnects

AI workloads also place extreme demands on memory bandwidth and interconnects. High Bandwidth Memory (HBM), a vertically stacked DRAM technology, has become critical for GPU-accelerated computing. Companies like SK Hynix and Samsung are investing heavily in HBM4, slated for debut in 2026–2027, with expected per-stack bandwidth exceeding 2 TB/s. On the interconnect front, NVIDIA's NVLink and the industry-standard Ultra Ethernet Consortium are competing to provide the low-latency, high-throughput connections needed for multi-node AI clusters. These secondary markets are fertile ground for investment as they directly benefit from AI adoption but trade at lower valuations than pure chip design firms.

Key Technology Trends Shaping 2026 and Beyond

Advanced Process Nodes: The Last Frontier?

The race for sub-2nm nodes continues, but diminishing returns are forcing a rethinking of scaling. TSMC's N2 process, planned for mass production by the end of 2026, introduces gate-all-around (GAA) nanosheet transistors, offering better energy efficiency and performance compared to FinFET. Intel is pursuing a similar architecture with its 18A node. Below 1nm, the industry is exploring complementary FET (CFET), which vertically stacks n-type and p-type transistors, effectively halving the footprint of logic cells. But these innovations come with exponential R&D costs and manufacturing complexity. For investors, the key question is whether leading foundries can maintain pricing power and margins as technology advantages narrow.

Advanced Packaging and Chip Architectures

With monolithic scaling slowing, advanced packaging has become a key differentiator. 3D stacking, through-silicon vias (TSVs), and hybrid bonding enable chip designers to integrate multiple dies—each optimized for different functions such as compute, memory, I/O—into a single package. This chiplet approach improves yield, reduces time-to-market, and allows heterogeneous integration of different process nodes. TSMC's CoWoS (Chip-on-Wafer-on-Substrate) and SoIC (System-on-Integrated Chips) technologies are in high demand for AI accelerators, with capacity sold out through 2027. Companies specializing in packaging equipment, materials, and services—such as Applied Materials, ASMPT, and Amkor Technology—will benefit significantly.

New Materials and Architectures

Beyond silicon, researchers are actively investigating new materials to sustain performance gains. Silicon photonics, which uses light rather than electrons for data transmission, promises lower power consumption and latency for inter-chip communication. While still nascent, silicon photonics could disrupt traditional copper interconnects within three to five years. Similarly, Gallium Nitride (GaN) and Silicon Carbide (SiC) are gaining adoption in power electronics, particularly in electric vehicles and renewable energy inverters. These wide-bandgap semiconductors offer higher efficiency and heat tolerance than traditional silicon, making them attractive for high-power applications.

Geopolitical Implications and Supply Chain Resilience

Semiconductors have become a focal point of strategic competition, particularly between the U.S. and China. The U.S. CHIPS and Science Act of 2022 allocated $52.7 billion for domestic semiconductor manufacturing, sparking a wave of fab construction in Arizona, Texas, and Ohio. TSMC, Intel, and Samsung are all building fabs on U.S. soil, though construction delays and skilled labor shortages remain challenges. Meanwhile, China is accelerating self-sufficiency, pouring billions into its domestic chip industry. While China still lags in cutting-edge logic, it has made progress in mature nodes (28nm and above) and memory.

The risk of supply chain disruptions—whether from geopolitical tensions, natural disasters, or export controls—remains high. Taiwan's vulnerability to a potential China-Taiwan conflict is a recurring concern, as TSMC produces nearly 90% of the world's most advanced chips. Efforts to replicate this capacity elsewhere (e.g., Japan, Germany, and the U.S.) are underway but will take years to reach meaningful scale. For investors, this geopolitical risk profile means diversification across geographies and fabs is prudent, as is investing in companies that benefit from the "chip nationalism" trend—such as equipment suppliers and EDA firms that are essential for fabs anywhere.

Investment Strategies for the Semiconductor Industry in 2026

Given the complex interplay of technology trends and geopolitical forces, a nuanced investment approach is required. Here are several strategies to consider:

1. Core Holdings: Foundry Leader and AI Chip Designer

TSMC and NVIDIA represent the two most dominant titans in the semiconductor ecosystem. TSMC's manufacturing prowess and customer relationships (including Apple, AMD, NVIDIA, and Broadcom) afford it exceptional pricing power and free cash flow generation. NVIDIA's continuous innovation in AI computing and its CUDA software ecosystem create a wide moat. Both trade at premium valuations, but their long-term growth trajectory justifies significant allocations for long-term investors.

2. Selective Investment in Semiconductor Equipment and Materials

The equipment and materials subsector benefits from long-term trends in fab construction and technology migration. Applied Materials, ASML (lithography), Lam Research (etch and deposition), and KLA (inspection) are well-positioned. ASML's monopoly on extreme ultraviolet (EUV) lithography makes it irreplaceable. Additionally, specialty materials suppliers like Tokuyama, Entegris, and Shin-Etsu Chemical have stable growth prospects.

3. High-Growth Niches: Memory, Packaging, and Edge AI

HBM memory makers like SK Hynix and Samsung offer opportunities to invest in AI demand at lower valuations compared to pure GPU stocks. Advanced packaging service providers (ASE Technology, Amkor) benefit from capacity constraints and pricing power. For edge AI, companies like Qualcomm (automotive and IoT NPUs), NXP Semiconductors, and Microchip Technology offer more modest growth but lower volatility.

4. Geopolitical Beneficiaries: Regional Foundries and Design Firms

As Chinese customers seek alternatives to Western chips, foundries in other Asian markets (e.g., United Microelectronics in Taiwan, GlobalFoundries in the U.S., and Tower Semiconductor in Israel) may gain incremental business. Chinese domestic design firms, such as HiSilicon (Huawei's chip design arm) and Horizon Robotics, are also worth attention, though they face headwinds from export controls. Investors willing to take higher risk may consider CHIPS Act beneficiaries: Intel ($8.5 billion in grants for its foundry transformation) and Micron (building new memory fabs in New York and Idaho).

5. Risk Management and Valuation Considerations

Semiconductor stocks are cyclical and sensitive to macroeconomic conditions. While AI demand is structurally supported, a slowdown in enterprise IT spending, a correction in AI stock bubbles, or an escalation in trade wars could trigger sharp declines. Therefore, investors should maintain diversification, avoid over-concentration in any single stock, and consider using stop-losses or options strategies to protect gains. Many AI stocks trade at trailing P/E ratios above 40, which may be justified by growth but also amplifies downside risk if earnings disappoint.

Conclusion: The Long-Term View of Semiconductors

The semiconductor industry lies at the heart of the Fourth Industrial Revolution. From AI and autonomous vehicles to 5G/6G communications and quantum computing, chips enable nearly every transformative technology of our time. The industry's long-term growth trajectory remains intact, supported by enduring demand for more computing power, better energy efficiency, and stronger connectivity.

For investors, 2026 offers a window of opportunity to build positions in companies that not only ride the AI wave but also possess durable competitive advantages: technology leadership, customer lock-in, and robust balance sheets. The key is to differentiate structural winners from cyclical performers, focus on technology inflection points (such as the shift to chiplets and advanced packaging), and remain vigilant about escalating geopolitical and regulatory risks.

As the image at the beginning of the article indicates, the guide to investing in AI-related stocks in 2026 is fundamentally a guide to semiconductor investment. The two are inseparable. Those who understand the technology, supply chain, and market dynamics will be best positioned to capture the extraordinary value creation ahead.

Disclaimer: This article is for informational purposes only and does not constitute investment advice. Past performance is not indicative of future results. Please consult a qualified financial advisor before making any investment decisions.

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  185. /www/wwwroot/cjgpcs.cn/vendor/topthink/framework/src/think/Cookie.php ( 6.06 KB )
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  191. /www/wwwroot/cjgpcs.cn/vendor/topthink/framework/src/think/session/Store.php ( 7.12 KB )
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  1. CONNECT:[ UseTime:0.001210s ] mysql:host=127.0.0.1;port=3306;dbname=cjgpcs;charset=utf8mb4
  2. SHOW FULL COLUMNS FROM `g3ys_config` [ RunTime:0.003449s ]
  3. SELECT `value` FROM `g3ys_config` WHERE `name` = 'timezone' AND `subsite_id` = '6' LIMIT 1 [ RunTime:0.000757s ]
  4. SHOW FULL COLUMNS FROM `g3ys_route` [ RunTime:0.003601s ]
  5. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000931s ]
  6. SHOW FULL COLUMNS FROM `g3ys_theme` [ RunTime:0.003805s ]
  7. SELECT `paginator` FROM `g3ys_theme` WHERE `module` = 'home' AND `name` = 'sgrateloan' AND `subsite_id` = '6' LIMIT 1 [ RunTime:0.000781s ]
  8. SHOW FULL COLUMNS FROM `g3ys_member` [ RunTime:0.005630s ]
  9. SELECT * FROM `g3ys_member` WHERE `id` = 0 AND `subsite_id` = '6' LIMIT 1 [ RunTime:0.001830s ]
  10. SHOW FULL COLUMNS FROM `g3ys_lang` [ RunTime:0.004434s ]
  11. SELECT * FROM `g3ys_lang` WHERE `subsite_id` = 6 AND ( ( LOWER(name) = 'en' ) OR `subtag` = 'en' ) AND `status` = 1 ORDER BY `id` ASC LIMIT 1 [ RunTime:0.001645s ]
  12. SHOW FULL COLUMNS FROM `g3ys_document` [ RunTime:0.005855s ]
  13. SELECT `id`,`document_type` FROM `g3ys_document` WHERE `subsite_id` = 6 AND `name` = '2026-semiconductor-investment-guide' AND `status` IN ('1','2') LIMIT 1 [ RunTime:0.001940s ]
  14. SELECT * FROM `g3ys_document` WHERE ( `name` = '5405' OR `id` = '5405' ) AND `subsite_id` = 6 LIMIT 1 [ RunTime:0.004482s ]
  15. SHOW TABLES LIKE 'g3ys_document_article' [ RunTime:0.004784s ]
  16. SHOW FULL COLUMNS FROM `g3ys_document_article` [ RunTime:0.003522s ]
  17. SELECT * FROM `g3ys_document_article` WHERE `document_id` = '5405' LIMIT 1 [ RunTime:0.001656s ]
  18. SHOW FULL COLUMNS FROM `g3ys_total` [ RunTime:0.003466s ]
  19. SELECT * FROM `g3ys_total` WHERE `target_id` = '5405' LIMIT 1 [ RunTime:0.000833s ]
  20. SHOW TABLES LIKE 'g3ys_document_article_lang' [ RunTime:0.004196s ]
  21. SHOW FULL COLUMNS FROM `g3ys_document_article_lang` [ RunTime:0.004956s ]
  22. SELECT * FROM `g3ys_document_article_lang` WHERE `subsite_id` = '6' AND `lang` = 'en' AND `document_id` = '5405' [ RunTime:0.009155s ]
  23. SHOW FULL COLUMNS FROM `g3ys_document_article_lang` [ RunTime:0.006442s ]
  24. SHOW TABLES LIKE 'g3ys_category_lang' [ RunTime:0.008791s ]
  25. SHOW FULL COLUMNS FROM `g3ys_category_lang` [ RunTime:0.003932s ]
  26. SELECT * FROM `g3ys_category_lang` WHERE `subsite_id` = '6' AND `category_id` = '1817' AND `lang` = 'en' LIMIT 1 [ RunTime:0.000945s ]
  27. SELECT * FROM `g3ys_total` WHERE `target_id` = '5405' LIMIT 1 [ RunTime:0.002444s ]
  28. UPDATE `g3ys_total` SET `view_total` = `view_total` + 1 WHERE `target_id` = '5405' [ RunTime:0.005083s ]
  29. SHOW FULL COLUMNS FROM `g3ys_record` [ RunTime:0.004528s ]
  30. SELECT `id` FROM `g3ys_record` WHERE `subsite_id` = '6' AND `type` = 'article' AND `url` = 'https://www.sgrateloan.com/2026-semiconductor-investment-guide' AND `create_time` >= 1785224508 AND ( `visitor_id` = '0c9b8372f87a4c0a87121ca7bba67d46' OR `session_id` = 'd55cd35e6cad3b56c79050144b4511a3' ) LIMIT 1 [ RunTime:0.001410s ]
  31. INSERT INTO `g3ys_record` SET `subsite_id` = '6' , `uid` = '0' , `visitor_id` = '0c9b8372f87a4c0a87121ca7bba67d46' , `session_id` = 'd55cd35e6cad3b56c79050144b4511a3' , `type` = 'article' , `target_id` = '5405' , `target_type` = 0 , `category_id` = '1817' , `title` = '2026 Semiconductor Investment Guide' , `url` = 'https://www.sgrateloan.com/2026-semiconductor-investment-guide' , `path` = '/2026-semiconductor-investment-guide' , `query_string` = '' , `referer` = '' , `referer_domain` = '' , `source_type` = 'direct' , `source_domain` = '' , `search_engine` = '' , `search_keyword` = '' , `utm_source` = '' , `utm_medium` = '' , `utm_campaign` = '' , `utm_term` = '' , `utm_content` = '' , `ip` = '216.73.217.117' , `user_agent` = 'Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)' , `device_type` = 'pc' , `browser` = '其他' , `browser_version` = '' , `os` = '其他' , `os_version` = '' , `language` = '' , `is_spider` = 0 , `spider_name` = '' , `status_code` = 200 , `country` = '' , `province` = '' , `city` = '' , `district` = '' , `isp` = '' , `region_code` = '' , `geo_status` = 0 , `geo_time` = 0 , `create_time` = 1785224568 , `update_time` = 1785224568 [ RunTime:0.003021s ]
  32. SHOW FULL COLUMNS FROM `g3ys_comment` [ RunTime:0.006031s ]
  33. SELECT COUNT(*) AS think_count FROM `g3ys_comment` WHERE `target_id` = '5405' AND `pid` = '0' [ RunTime:0.000794s ]
  34. SELECT * FROM `g3ys_document` WHERE `category_id` = 1817 AND `subsite_id` = 6 AND `pid` = '0' AND `status` = '1' AND ( ( sort > 0) or ( sort = 0 and id < 5405) ) ORDER BY `sort` ASC,`id` DESC LIMIT 1 [ RunTime:0.001911s ]
  35. SELECT * FROM `g3ys_document` WHERE `category_id` = 1817 AND `subsite_id` = 6 AND `pid` = '5404' AND `status` = '1' ORDER BY `sort` ASC,`id` DESC LIMIT 1 [ RunTime:0.001716s ]
  36. SELECT * FROM `g3ys_document_article_lang` WHERE `subsite_id` = '6' AND `lang` = 'en' AND `document_id` = '5404' [ RunTime:0.004002s ]
  37. SELECT * FROM `g3ys_document` WHERE `category_id` = 1817 AND `subsite_id` = 6 AND `pid` = '5405' AND `status` = '1' AND `document_type` = 0 ORDER BY `sort` DESC,`id` ASC LIMIT 1 [ RunTime:0.001321s ]
  38. SELECT * FROM `g3ys_document` WHERE `category_id` = 1817 AND `subsite_id` = 6 AND `pid` = '0' AND `status` = '1' AND `document_type` = 0 AND ( ( sort>0 and sort <= 0 and id!=5405) or ( sort = 0 and id > 5405) ) ORDER BY `sort` DESC,`id` ASC LIMIT 1 [ RunTime:0.002043s ]
  39. SELECT * FROM `g3ys_document_article_lang` WHERE `subsite_id` = '6' AND `lang` = 'en' AND `document_id` = '5573' [ RunTime:0.004347s ]
  40. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.001204s ]
  41. SELECT * FROM `g3ys_category_lang` WHERE `subsite_id` = '6' AND `category_id` = '1813' AND `lang` = 'en' LIMIT 1 [ RunTime:0.000660s ]
  42. SELECT * FROM `g3ys_category_lang` WHERE `subsite_id` = '6' AND `category_id` = '1816' AND `lang` = 'en' LIMIT 1 [ RunTime:0.000600s ]
  43. SELECT * FROM `g3ys_category_lang` WHERE `subsite_id` = '6' AND `category_id` = '1819' AND `lang` = 'en' LIMIT 1 [ RunTime:0.000595s ]
  44. SELECT * FROM `g3ys_category_lang` WHERE `subsite_id` = '6' AND `category_id` = '2048' AND `lang` = 'en' LIMIT 1 [ RunTime:0.000751s ]
  45. SELECT * FROM `g3ys_category_lang` WHERE `subsite_id` = '6' AND `category_id` = '2049' AND `lang` = 'en' LIMIT 1 [ RunTime:0.000682s ]
  46. SELECT * FROM `g3ys_category_lang` WHERE `subsite_id` = '6' AND `category_id` = '2050' AND `lang` = 'en' LIMIT 1 [ RunTime:0.000732s ]
  47. SELECT * FROM `g3ys_total` WHERE `target_id` = '5405' LIMIT 1 [ RunTime:0.000642s ]
  48. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000806s ]
  49. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000690s ]
  50. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.001018s ]
  51. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000933s ]
  52. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000946s ]
  53. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000693s ]
  54. SHOW FULL COLUMNS FROM `g3ys_ad_location` [ RunTime:0.002796s ]
  55. SELECT * FROM `g3ys_ad_location` WHERE `name` = 'whatsapp-window' AND `subsite_id` = '6' AND `status` = 1 LIMIT 1 [ RunTime:0.001335s ]
  56. SHOW FULL COLUMNS FROM `g3ys_ad` [ RunTime:0.004124s ]
  57. SELECT * FROM `g3ys_ad` WHERE `subsite_id` = '6' AND `ad_location_id` = '4' AND `status` = 1 AND `device` IN ('all','pc') AND ( `start_time` = 0 OR `start_time` <= 1785224568 ) AND ( `end_time` = 0 OR `end_time` >= 1785224568 ) ORDER BY `sort` DESC,`id` DESC [ RunTime:0.001232s ]
  58. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000835s ]
  59. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.001168s ]
  60. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000839s ]
  61. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000902s ]
  62. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.001065s ]
  63. SHOW FULL COLUMNS FROM `g3ys_tags` [ RunTime:0.002890s ]
  64. SELECT * FROM `g3ys_tags` WHERE `subsite_id` = 6 AND `status` = 1 ORDER BY `sort` DESC,`id` DESC LIMIT 15 [ RunTime:0.000980s ]
  65. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000763s ]
  66. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.001053s ]
  67. SELECT * FROM `g3ys_route` WHERE ( `subsite_id` = '6' OR `subsite_id` = '0' ) AND `module` = 'home' AND `status` = 1 ORDER BY `sort` DESC,`id` ASC [ RunTime:0.000779s ]
0.548793s