CrossChip Breaks 3D NAND Stacking Bottleneck: First Hybrid Bonding Tech Enables 300-Layer Mass Production, Storage Density Soars 40%
On August 4, 2026, CrossChip announced its 8th-gen 3D NAND flash, based on wafer-to-wafer hybrid bonding, has broken the 300-layer bottleneck and entered risk production. This tech boosts single-chip density by 40% and cuts power by 25%, poised to reshape storage for data centers and AI edge computing.
